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Integra Foundry
Capabilities / Reference envelope

The build envelope.

PCB fabrication, PCB assembly, inspection, testing, component sourcing and manufacturing coordination, described as the envelope orders are routed within. Final limits depend on the partner factory selected for your build.

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100.0 mm60.0 mmU1 QFP-640.5 mm pitchU2 BGA0.8 mm pitchC/R 0402passivesJ1 HEADERthrough-hole
Operating summary
Demonstration data — edit in app/capabilities/page.tsx
Assembly location
United States (partner cells)
Inspection & testing
AOI · X-ray · functional
Fabrication regions
US domestic · selected overseas
Typical turn time
Confirmed per quote
Maximum layer count
Up to 32 layers
Component placement
01005 / 0.4 mm pitch
RF capabilities
DC to 77 GHz laminates
01Assembly

Assembly

Surface-mount (SMT) and through-hole (THT) assembly, including mixed-technology boards, fine-pitch and area-array packages.

Assembly capability

Reference values
Assembly types
Capability:SMT single / double-sided · THT · mixed SMT + THT · selective solder
Smallest component placement
Capability:01005 (0.4 × 0.2 mm) imperial
Package support
Capability:0201–2512 chip · SOIC · QFP · QFN · DFN · LGA · BGA · CSP · POP · connectors
Minimum pitch
Capability:0.4 mm QFP / QFN · 0.35 mm BGA (advanced)
Substrate types
Capability:FR-4 · high-Tg FR-4 · polyimide flex · rigid-flex · PTFE / hydrocarbon RF · aluminium-core
Production volume
Capability:Prototype (1 pc) through low- and mid-volume production
Turnaround
Capability:Per-quote; expedited routes available where capacity permits
Solder alloys
Capability:SAC305 · SnPb 63/37 (where permitted) · low-temperature Sn-Bi on request
Cleaning
Capability:No-clean standard · aqueous / ultrasonic on request
Inspection
Capability:SPI · AOI · 2D / 3D X-ray · first-article inspection

Equipment

Per partner cell
Solder paste printing
Equipment class:Automatic stencil printer
Notes:Vision alignment · under-wipe · stepped stencils
Solder paste inspection
Equipment class:3D SPI
Notes:Volume, area, height, offset
Pick-and-place
Equipment class:High-speed + fine-pitch placement
Notes:Vision centering · feeder-verified loading
Reflow
Equipment class:Convection, 8–12 zones
Notes:Nitrogen option · profile logged per job
Wave soldering
Equipment class:Lead-free wave
Notes:Pallets / selective masks
Selective soldering
Equipment class:Programmable mini-wave
Notes:Dense mixed-technology boards
AOI
Equipment class:3D / multi-angle optical
Notes:Polarity, presence, offset, solder joint
X-ray inspection
Equipment class:2D / 3D microfocus
Notes:BGA / QFN voiding, hidden joints
BGA rework
Equipment class:IR / hot-air with profiling
Notes:Reball, remove, replace
Cleaning
Equipment class:Inline / batch
Notes:Ionic contamination testing on request
02Fabrication

Fabrication

Rigid, flex, rigid-flex, HDI, RF and mixed-material boards. Values are split into Standard (routine) and Advanced (engineering review) windows.

2.1 Fabrication envelope

Layer count
Standard:1 – 16
Advanced:Up to 32
Finished board thickness
Standard:0.8 – 2.4 mm
Advanced:0.2 – 6.0 mm
Maximum panel size
Standard:457 × 610 mm (18 × 24 in)
Advanced:533 × 610 mm
Maximum board size
Standard:430 × 580 mm
Advanced:Per-job review
Minimum board size
Standard:5 × 5 mm
Advanced:Panelised with rails
Aspect ratio (through hole)
Standard:10 : 1
Advanced:16 : 1
FIG. 04 — TYPICAL 6-LAYER RIGID CONSTRUCTION (ILLUSTRATIVE)SOLDERMASKL1 COPPERPREPREGL2 COPPERCOREL3 COPPERPREPREGL4 COPPERCOREL5 COPPERPREPREGL6 COPPERSOLDERMASKTHROUGH VIABLIND MICROVIABURIED VIA

2.2 Board construction

Rigid multilayer
Standard:Sequential lamination ×1
Advanced:Sequential lamination ×3+
Flexible
Standard:1–2 layer polyimide
Advanced:4+ layer flex · stiffeners
Rigid-flex
Standard:2 flex + rigid outer
Advanced:Multiple flex cores · bookbinder
HDI
Standard:1 + N + 1
Advanced:2 + N + 2 · any-layer
Heavy copper
Standard:Up to 3 oz
Advanced:Up to 6 oz (extreme)
Metal-core
Standard:Aluminium single layer
Advanced:Copper-core · embedded

2.3 Trace and space by copper weight

Minimum, outer / inner
½ oz (17 µm)
Standard:3.5 / 3.5 mil outer · 3 / 3 mil inner
Advanced:2.5 / 2.5 mil outer · 2.5 / 2.5 mil inner
1 oz (35 µm)
Standard:4 / 4 mil outer · 3.5 / 3.5 mil inner
Advanced:3 / 3 mil outer · 3 / 3 mil inner
2 oz (70 µm)
Standard:6 / 7 mil outer · 5 / 6 mil inner
Advanced:5 / 6 mil outer · 5 / 5 mil inner
3 oz (105 µm)
Standard:10 / 10 mil
Advanced:8 / 9 mil
4 oz and above
Standard:Per-job review
Advanced:Per-job review

2.4 Board thickness by layer count

1 – 2 layers
Standard:0.8 – 2.4 mm ± 10%
Advanced:0.2 – 3.2 mm
4 layers
Standard:0.8 – 2.4 mm ± 10%
Advanced:0.4 – 3.2 mm
6 – 8 layers
Standard:1.0 – 2.4 mm ± 10%
Advanced:0.8 – 3.2 mm
10 – 16 layers
Standard:1.6 – 3.2 mm ± 10%
Advanced:1.2 – 4.0 mm
18 – 32 layers
Standard:—
Advanced:2.4 – 6.0 mm · per-job review

2.5 Drilling

Mechanical
Minimum drill size
Standard:0.20 mm (8 mil)
Advanced:0.15 mm (6 mil)
Hole position tolerance
Standard:± 3 mil
Advanced:± 2 mil
PTH diameter tolerance
Standard:± 3 mil
Advanced:± 2 mil
NPTH diameter tolerance
Standard:± 2 mil
Advanced:± 1 mil
Laser
Laser via diameter
Standard:0.10 mm (4 mil)
Advanced:0.075 mm (3 mil)
Laser aspect ratio
Standard:0.8 : 1
Advanced:1 : 1
Annular ring
Outer layer (IPC Class 2)
Standard:4 mil
Advanced:3 mil
Inner layer
Standard:4 mil
Advanced:3 mil
Laser microvia capture pad
Standard:6 mil
Advanced:5 mil

2.6 Via technology

Through via
Standard:Plated, tented or plugged
Advanced:Plugged and capped (VIPPO)
Blind via
Standard:Laser, 1 level
Advanced:Laser or mechanical, multi-level
Buried via
Standard:Mechanical, 1 core
Advanced:Multiple cores
Stacked microvia
Standard:2-deep
Advanced:3+ deep · filled and capped
Via-in-pad
Standard:Epoxy-filled, plated over
Advanced:Copper-filled
Back-drilling
Standard:Stub ≤ 12 mil
Advanced:Stub ≤ 8 mil

2.7 Controlled impedance

Single-ended
Standard:± 10%
Advanced:± 7%
Differential
Standard:± 10%
Advanced:± 7%
Coplanar waveguide
Standard:± 10%
Advanced:± 8%
Impedance range
Standard:28 – 120 Ω
Advanced:25 – 150 Ω
Verification
Standard:TDR coupon per panel
Advanced:TDR coupon per panel + report

2.8 Silkscreen

Colours
Standard:White · black
Advanced:Yellow · additional on request
Minimum line width
Standard:5 mil
Advanced:4 mil
Minimum character height
Standard:30 mil
Advanced:25 mil
Registration tolerance
Standard:± 6 mil
Advanced:± 4 mil (LDI legend)
Clearance to pad
Standard:5 mil
Advanced:4 mil

2.9 Soldermask

Colours
Standard:Green · black · blue · red · white
Advanced:Matte variants · custom on request
Mask thickness
Standard:10 – 25 µm over copper
Advanced:Per-job
Minimum mask dam
Standard:4 mil
Advanced:3 mil
Mask registration
Standard:± 3 mil
Advanced:± 2 mil (LDI)
Via treatment
Standard:Tented · open · plugged
Advanced:Plugged and capped

2.10 Surface finishes

HASL (lead-free)
Standard:Available
Advanced:—
ENIG
Standard:2 – 5 µin Au over 120 – 240 µin Ni
Advanced:Thick gold on request
ENEPIG
Standard:Available
Advanced:Wire-bond grades
Immersion silver / tin
Standard:Available
Advanced:—
OSP
Standard:Available
Advanced:—
Hard gold (edge fingers)
Standard:Available
Advanced:Selective plating

2.11 Laminate and material systems

Standard FR-4
Examples:Tg 130 – 150 °C
Typical use:General digital and power
High-Tg FR-4
Examples:Tg 170 – 180 °C
Typical use:Multilayer · lead-free assembly
Halogen-free
Examples:Tg 150 – 170 °C
Typical use:Regulatory-driven builds
Low-loss / high-speed
Examples:Df ≤ 0.005 laminates
Typical use:Serial links · backplanes
Polyimide
Examples:Flex and rigid-flex
Typical use:Dynamic and static flex
PTFE / hydrocarbon
Examples:Df ≤ 0.002 laminates
Typical use:RF · microwave
Metal-core
Examples:Aluminium dielectric
Typical use:LED · power
rigid
flex
rigid-flex
hdi
rf
mixed

2.12 Product types

Rigid
Typical construction:1 – 32 layers
Notes:Mainstream builds
Flexible
Typical construction:1 – 6 layers
Notes:Coverlay · stiffeners · ZIF contacts
Rigid-flex
Typical construction:Rigid outer + flex core
Notes:IPC-2223 guidelines
HDI
Typical construction:Microvia buildup
Notes:Fine-pitch BGA escape
RF / microwave
Typical construction:PTFE · hybrid stackups
Notes:Controlled-depth routing
Mixed material
Typical construction:FR-4 + RF laminate hybrid
Notes:Per-job stackup review

2.13 RF and microwave

Frequency range
Standard:DC – 6 GHz
Advanced:To 77 GHz (laminate-dependent)
Dielectric constant (Dk)
Standard:3.0 – 4.5
Advanced:2.2 – 10.2
Loss tangent (Df)
Standard:≤ 0.004
Advanced:≤ 0.0009
Hybrid stackups
Standard:RF outer + FR-4 core
Advanced:Multi-RF hybrid
Edge plating / castellations
Standard:Available
Advanced:Per-job
Cavity / controlled-depth routing
Standard:—
Advanced:Available

All values are editable demonstration data and are not a commitment of capability.

03Design

Design

Layout and review support that carries a design through to manufacturing outputs.

Design capability

  • PCB layout support
  • Multilayer design
  • Digital circuits
  • Analog circuits
  • RF circuits
  • High-density PCB design
  • Stackup and impedance planning

Deliverables

  • DFM review report
  • DFT review report
  • Gerber / ODB++ output
  • NC drill and netlist
  • Assembly drawings
  • Pick-and-place data
  • Fabrication notes

Secondary operations

  • Conformal coating
  • Underfill and staking
  • Programming
  • Box build and integration
  • Labelling and serialisation
  • Custom packaging

Review scope

DFM
Checks:Trace / space · drill · annular ring · mask dams · panelisation
Output:Annotated findings
DFT
Checks:Test-point coverage · access · fixture feasibility
Output:Test-coverage notes
Manufacturing outputs
Checks:File completeness · BOM / placement agreement
Output:Release package
04Testing and inspection

Testing and inspection

Inspection at each stage and test coverage matched to the design.

01Automated optical inspectionDetects missing, misplaced, rotated components and solder defects after reflow.
02X-ray inspectionInspects hidden joints on BGA, QFN and LGA packages, including voiding.
03Functional testingPowered tests against customer-supplied procedures or coordinated fixtures.
04Board bring-upInitial power-up, rail checks and first-boot verification of new designs.
05Firmware flashingProgramming of customer-supplied images with verification.
06EMC-related testing coordinationScheduling and handoff to third-party labs; Integra Foundry does not itself certify compliance.
07Custom testing fixturesDesign and build of bed-of-nails and functional fixtures.
08ReworkComponent replacement, BGA reball and modification per approved instructions.
05Parts and sourcing

Parts and sourcing

Components are sourced against your BOM, or supplied by you. Handling follows the same rules in both cases.

Sourcing models

Who buys the parts
Turnkey:Network sourcing against BOM
Customer-consigned:Customer supplies kits
BOM verification
Turnkey:Automated MPN / package check
Customer-consigned:Kit audit against BOM at receipt
Overage / attrition
Turnkey:Included in quote by part class
Customer-consigned:Customer specifies
Lead-time risk
Turnkey:Flagged in the quote
Customer-consigned:Owned by customer
Substitutions
Turnkey:Only with written approval
Customer-consigned:Not applicable

Handling and traceability

ESD handling
Practice:ESD-safe workstations, packaging and grounding per ANSI/ESD S20.20 practice
Moisture-sensitive components
Practice:Dry-cabinet storage and bake per J-STD-033 with MSL tracking
Lot traceability
Practice:Reel / lot and date-code recorded against each build
Inventory management
Practice:Kit-level reconciliation and returns of unused stock
06Standards

Standards

Standards and qualification criteria that apply to builds. These are not claims that Integra Foundry holds any certification; partner factories are asked to evidence theirs.

Applicable standards

Status: to be verified
ISO 9001
Scope:Quality management systems
Status:Partner qualification criterion
AS9100
Scope:Aerospace quality management
Status:Partner qualification criterion
ISO 13485
Scope:Medical device quality management
Status:Partner qualification criterion
IPC-A-600
Scope:Acceptability of printed boards
Status:Applied as inspection reference
IPC J-STD-001
Scope:Soldered electrical and electronic assemblies
Status:Applied as workmanship reference
UL
Scope:Laminate / board recognition
Status:Partner qualification criterion
RoHS
Scope:Restricted substances
Status:Material declaration on request
ITAR
Scope:Controlled defence articles / data
Status:Domestic-only routing; contact before sending data

No certification is asserted for the company until independently verified and published here.

Box build & integration

Built into the product.

Beyond the board: enclosures, heatsinks, harnesses and final test, coordinated as one order.

Power controller01 · Heatsink plate and cover
Control module02 · Front panel, board, chassis
Sealed enclosure03 · Board, tray and lid

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File checklist
  • Gerbers or ODB++
  • NC drill files
  • Bill of materials
  • Placement data
  • Fabrication drawing
  • Test requirements